Semiconductor device, systems and methods of manufacture

ABSTRACT

A semiconductor memory device includes a stack of word lines and insulating patterns. Cell pillars extend vertically through the stack of word lines and insulating patterns with memory cells being formed at the junctions of the cell pillars and the word lines. A ratio of the thickness of the word lines to the thickness of immediately neighboring insulating patterns is different at different locations along one or more of the cell pillars. Related methods of manufacturing and systems are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application is a continuation of andclaims priority to U.S. non-provisional patent application Ser. No.16/045,997, filed on Jul. 26, 2018, which is a continuation of andclaims priority to U.S. non-provisional patent application Ser. No.14/474,867 filed on Sep. 2, 2014, which claims priority under 35 U.S.C.§ 119 to Korean Patent Application No. 10-2013-0105006, filed on Sep. 2,2013, in the Korean Intellectual Property Office, the disclosures ofeach of which are hereby incorporated by reference in their entirety.

BACKGROUND

Semiconductor devices have been more highly integrated in order toprovide high performance and low cost thereof. In particular, theintegration density of semiconductor devices directly influences thecosts of the semiconductor devices. The integration degree of aconventional two-dimensional (2D) memory device is mainly determined byan area that a unit memory cell occupies. Therefore, the integrationdensity of the conventional 2D memory device is greatly affected by thelevel of a technique for forming fine patterns.

Three-dimensional (3D) semiconductor devices includingthree-dimensionally arranged memory cells address the above limitationsof two-dimensional memory devices. Manufacturing techniques and productsthat are capable of reducing bit cost and realizing reliable productsare desired for successful mass production of the 3D semiconductordevices.

SUMMARY

Embodiments of the inventive concepts may provide semiconductor deviceswith improved reliability. In some embodiments, a semiconductor devicecomprises a substrate; a stack comprising a plurality of word lines andinsulating patterns vertically stacked on the substrate, correspondingones of the insulating patterns being sandwiched between neighboringones of the word lines; and a plurality of cell pillars verticallyextending through the stack of the plurality of word lines andinsulating patterns, memory cells being formed at junctions of the cellpillars and the word lines. A first portion of the stack may comprise afirst word line having a first thickness and a second portion of thestack may comprise a second word line having a second thicknessdifferent from the first thickness.

A third portion of the stack may comprise a third word line having athird thickness, wherein the third thickness and the first thickness areless than the second thickness, and wherein the second portion of thestack is interposed between the first portion of the stack and the thirdportion of the stack.

The second portion of the stack may include the middle of the stack.

The third thickness may be equal to the first thickness.

The ratio of the second thickness to the first thickness may be greaterthan or equal to 1.1.

The first thickness may be in the range of 35 nm to 42 nm.

The stack comprises an upper select line stacked on the plurality ofword lines and insulating patterns and a lower select line interposedbetween the substrate and the plurality of word lines and insulatingpatterns.

Each of the memory cells may comprise a nonvolatile memory cell.

Each of the memory cells may comprise a nonvolatile memory transistor.

Each of cell pillars may comprise a conductive core, and wherein each ofthe memory transistors comprise a charge storage element positionedbetween the conductive core and a corresponding word line.

The semiconductor device may be a vertical NAND memory device and eachcell pillar may form a cell string of the vertical NAND.

Each of the memory cells may comprise a data storage element comprisinga material having a variable resistance property.

Each of the memory cells may comprise a data storage element comprisinga phase change material.

Each of the memory cells may comprise a data storage element comprisingat least one of a ferromagnetic material and an anti-ferromagneticmaterial.

A diameter of a first cell pillar within the first portion of the stackmay be smaller than a diameter of the first cell pillar within thesecond portion of the stack.

The diameter of the first cell pillar within the first portion of thestack may be less than 42 nm.

A third portion of the stack may comprise a word line having a thirdthickness. The first thickness and the third thickness may be less thanthe second thickness, the second portion of the stack may be interposedbetween the first portion of the stack and the third portion of thestack, and a diameter of a first cell portion within the first portionof the stack may be smaller than a diameter of the first cell pillarwithin the second portion of the stack.

The second portion of the stack may include the middle of the stack.

A cross section of a first cell pillar within the first portion of thestack may have less striation than a cross section of the first cellpillar within the second portion of the stack.

A third portion of the stack may comprise a third word line having athird thickness, wherein the first thickness and the third thickness aregreater than the second thickness, wherein the second portion of thestack is interposed between the first portion of the stack and the thirdportion of the stack, and wherein a cross section of a first cell pillarwithin the first portion of the stack has less striation than a crosssection of the first cell pillar within the second portion of the stack.

The first portion may comprise a first insulating pattern immediatelyadjacent to the first word line, the second portion may comprise asecond insulating pattern immediately adjacent to the second word line,and a ratio of the second thickness to a thickness of the secondinsulating pattern is different than a ratio of the first thickness to athickness of the first insulating pattern.

The second portion may comprise a plurality of second word lines eachhaving the second thickness and a plurality of second insulatingpatterns each having a same thickness. At least some of the second wordlines and second insulating patterns may be located in the middle of thestack.

A ratio of the second thickness to the thickness of the secondinsulating pattern may be greater than 1.3.

A diameter of a first cell pillar at the first word line is smaller thana diameter of the first cell pillar at the second word line.

In some embodiments, the ratio of the second thickness to the thicknessof the second insulating pattern is less than a ratio of the firstthickness to a thickness of the first insulating pattern. For example,the ratio of the second thickness to the thickness of the secondinsulating pattern is less than 1.3. Further, a cross section of a firstcell pillar at the first word line has less striation than a crosssection of the first cell pillar at the second word line.

In some examples, a semiconductor device comprises a substrate; a stackcomprising a plurality of word lines and insulating patterns verticallystacked on the substrate, corresponding ones of the insulating patternsbeing sandwiched between neighboring ones of the word lines; and aplurality of cell pillars vertically extending through the stack of theplurality of word lines and insulating patterns, memory cells beingformed at junctions of the cell pillars and the word lines. A firstportion of the stack may comprise a first word line having a firstthickness and a first insulating pattern immediately adjacent to thefirst word line, a second portion of the stack may comprise a secondword line having a second thickness a second insulating patternimmediately adjacent to the second word line, and a ratio of the secondthickness to the thickness of the second insulating pattern may bedifferent than a ratio of the first thickness to a thickness of thefirst insulating pattern.

A third portion of the stack may comprise a third word line having athird thickness and a third insulating pattern immediately adjacent thethird word line, the second portion of the stack may be interposedbetween the first portion of the stack and the third portion of thestack, and a ratio of the first thickness to the thickness of the firstinsulating pattern may be substantially equal to a ratio of the thirdthickness to a thickness of the third insulating pattern.

The first thickness may be substantially equal to the third thickness.

The first thickness and the third thickness may be less than the secondthickness.

The second portion may comprise a plurality of second word lines havingthe second thickness and a plurality of second insulating patternshaving the second thickness, and at least some of the second word linesand second insulating patterns may be located in the middle of thestack.

The ratio of the second thickness to the thickness of the secondinsulating pattern may be greater than a ratio of the first thickness toa thickness of the first insulating pattern.

A diameter of a first cell pillar at the first word line may be smallerthan a diameter of the first cell pillar at the second word line.

The ratio of the second thickness to the thickness of the secondinsulating pattern is greater than 1.3.

The second word line may be in the middle of the stack.

In some examples, the ratio of the second thickness to the thickness ofthe second insulating pattern is less than a ratio of the firstthickness to a thickness of the first insulating pattern. A crosssection of a first cell pillar at the first word line may have lessstriation than a cross section of the first cell pillar at the secondword line. Further, the ratio of the second thickness to the thicknessof the second insulating pattern may be less than 1.3.

Methods for manufacturing and systems including the devices describedherein are also disclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

The inventive concepts will become more apparent in view of the attacheddrawings and accompanying detailed description.

FIG. 1 is a block diagram illustrating a semiconductor device accordingto some embodiments of the inventive concepts;

FIG. 2 is a block diagram illustrating an example of a memory cell arrayof a semiconductor device illustrated in FIG. 1;

FIG. 3 is a perspective view illustrating a memory block of asemiconductor device according to some embodiments of the inventiveconcepts;

FIG. 4A is a plan view illustrating an embodiment of a memory block ofFIG. 3;

FIG. 4B is a cross-sectional view taken along a line I-I′ of FIG. 4A;

FIG. 4C is an enlarged view of a portion ‘A’ of FIG. 4B;

FIGS. 5A to 10A, 13A, and 14A are plan views corresponding to FIG. 4A;

FIGS. 5B to 10B, 13B, and 14B are cross-sectional views corresponding toFIG. 4B;

FIGS. 5C to 10C, 13C, and 14C are enlarged views of portions ‘B’ ofFIGS. 5B to 10B, 13B, and 14C, respectively;

FIG. 11 is a cross-sectional view corresponding to FIG. 10B;

FIG. 12 is a graph illustrating a leakage current between word linesaccording to a thickness of an insulating pattern;

FIG. 15A is an enlarged view of a portion ‘C’ of FIG. 14A;

FIG. 15B is an enlarged view of a portion ‘D’ of FIG. 14C and is across-sectional view taken along a line II-IF of FIG. 15A;

FIGS. 16A to 16D are enlarged views corresponding to FIG. 4C toillustrate other embodiments of a memory block of FIG. 3;

FIG. 17 is a cross-sectional view illustrating an example embodiment ofa memory block of FIG. 3;

FIGS. 18A to 18C are plan views taken along lines A1-A1′, A2-A2′, andA3-A3′ of FIG. 17, respectively;

FIGS. 19A to 19C are plan views taken along lines A1-A1′, A2-A2′, andA3-A3′ of FIG. 17, respectively;

FIG. 20 is a schematic block diagram illustrating an example of anelectronic system including a semiconductor device according toembodiments of the inventive concepts;

FIG. 21 is a schematic block diagram illustrating an example of a memorysystem including a semiconductor device according to embodiments of theinventive concepts; and

FIG. 22 is a schematic block diagram illustrating an example of aninformation processing system including a semiconductor device accordingto embodiments of the inventive concepts.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The advantages and features of the inventive concepts and methods ofachieving them will be apparent from the following exemplary embodimentsthat will be described in more detail with reference to the accompanyingdrawings. It should be noted, however, that the present invention is notlimited to the following example embodiments, and may be implemented invarious forms. These example embodiments are just that—examples—and manyimplementations and variations are possible that do not require thedetails provided herein. It should also be emphasized that thedisclosure provides details of alternative examples, but such listing ofalternatives is not exhaustive. Furthermore, any consistency of detailbetween various examples should not be interpreted as requiring suchdetail—it is impracticable to list every possible variation for everyfeature described herein. The language of the claims should bereferenced in determining the requirements of the invention.

In the drawings, the thickness of layers and regions may be exaggeratedfor clarity. Like numbers refer to like elements throughout. Devices andmethods of forming devices according to various embodiments describedherein may be embodied in microelectronic devices such as integratedcircuits, wherein a plurality of devices according to variousembodiments described herein are integrated in the same microelectronicdevice. Accordingly, cross-sectional view(s) illustrated herein (even ifillustrated in a single direction or orientation) may exist in differentdirections or orientations (which need not be orthogonal or related asset forth in the described embodiments) in the microelectronic device.Thus, a plan view of the microelectronic device that embodies devicesaccording to various embodiments described herein may include aplurality of the devices in an array and/or in a two-dimensional patternhaving orientations that may be based on the functionality or otherdesign considerations of the microelectronic device. The cross-sectionalview(s) illustrated herein provide support for a plurality of devicesaccording to various embodiments described herein that extend along twodifferent directions in a plan view and/or in three different directionsin a perspective view. For example, when a single active region isillustrated in a cross-sectional view of a device/structure, thedevice/structure may include a plurality of active regions and/ortransistor structures (and/or memory cell structures, gate structures,etc., as appropriate to the case) that may have a variety oforientations.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to limit the invention. As usedherein, the singular terms “a,” “an” and “the” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. It will beunderstood that when an element is referred to as being “connected” or“coupled” to another element, it may be directly connected or coupled tothe other element or intervening elements may be present. Other wordsused to describe the relationship between elements should be interpretedin a like fashion (e.g., “between” versus “directly between,” “adjacent”versus “directly adjacent,” etc.).

Similarly, it will be understood that when an element such as a layer,region or substrate is referred to as being “on” another element, it canbe directly on the other element or intervening elements may be present.In contrast, the term “directly” means that there are no interveningelements. It will be further understood that the terms “comprises,”“comprising,” “includes” and/or “including,” when used herein, specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

It will be also understood that although the terms first, second, thirdetc. may be used herein to describe various elements, these elementsshould not be limited by these terms. These terms are only used todistinguish one element from another element. Thus, a first element insome embodiments (or claims) could be termed (or claimed as) a secondelement in other embodiments without departing from the teachings of thepresent invention. Exemplary embodiments of aspects of the presentinventive concepts explained and illustrated herein include theircomplementary counterparts. The same reference numerals or the samereference designators denote the same elements throughout thespecification.

Moreover, exemplary embodiments are described herein with reference tocross-sectional illustrations and/or plane illustrations that may beidealized exemplary illustrations. Accordingly, variations from theshapes of the illustrations as a result, for example, of manufacturingtechniques and/or tolerances, are to be expected. Thus, exemplaryembodiments should not be construed as limited to the shapes of regionsillustrated herein but may include deviations in shapes that result, forexample, from manufacturing. For example, an etching region illustratedas a rectangle will, typically, have rounded or curved features. Thus,the regions illustrated in the figures are schematic in nature and theirshapes may not illustrate the actual shape of a region of a device.

In the specification of the inventive concepts, the concept of anelement or feature being “nonmonotonically varied as a height from asubstrate increases” refers to the element or feature, such as a size(e.g., a width, a thickness, a space or a diameter, etc.) of an elementdoes not consistently change (e.g., increase or decrease) as a heightfrom a substrate increases. For example, the size of the element maydecrease and then increase, or increase and then decrease, or oscillateas a height from a substrate increases.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper”, and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present inventive conceptbelongs. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand this specification and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Hereinafter, embodiments of the inventive concepts will be described indetail.

FIG. 1 is a block diagram illustrating a semiconductor device accordingto some embodiments of the inventive concepts. Referring to FIG. 1, asemiconductor device may include a memory cell array 10, an addressdecoder 20, a read/write circuit 30, a data input/output (I/O) circuit40, and a control logic circuit 50.

The memory cell array 10 of FIG. 1 is connected to the address decoder20 through a plurality of word lines WL and connected to the read/writecircuit 30 through bit lines BL. The memory cell array 10 includes aplurality of memory cells. For example, each memory cell of the memorycell array 10 may store a bit of data or a plurality of bits of data.

The address decoder 20 of FIG. 1 is connected to the memory cell array10 through the word lines WL. The address decoder 20 may be operated bythe control logic circuit 50. The address decoder 20 may receive addresssignals ADDR from an external system. The address decoder 20 decodes arow address signal of the received address signals ADDR to select acorresponding word line of the plurality of wore lines WL. Additionally,the address decoder 20 decodes a column address signal of the receivedaddress signals ADDR and then transmits the decoded column addresssignal to the read/write circuit 30. The address decoder 20 may includewell-known components such as a row decoder, a column decoder, and anaddress buffer.

The read/write circuit 30 of FIG. 1 is connected to the memory cellarray 10 through the bit lines BL and to the data I/O circuit 40 throughdata lines DL. The read/write circuit 30 may be operated by the controllogic circuit 50. The read/write circuit 30 is configured to receive thedecoded column address signal from the address decoder 20. Theread/write circuit 30 selects one of the bit lines BL by using thedecoded column address. For example, the read/write circuit 30 receivesdata from the data I/O circuit 40 and writes the received data into thememory cell array 10. The read/write circuit 30 reads data from thememory cell array 10 and transmits the read data to the data I/O circuit40. The read/write circuit 30 may read data from a first storage regionof the memory cell array 10 and may write the read data into a secondstorage region of the memory cell array 10. For example, the read/writecircuit 30 may be configured to perform a copy-back operation.

The read/write circuit 30 may include a page buffer (or a page register)and a column selection circuit. The page buffer may store a page of datacorresponding to data to be written to or read from a page of the memorycell array. The page of data may include a m bits of data where m=n×thenumber of memory cells operatively connected to a word line WL and wheren is an integer equal to or greater than one. The read/write circuit 30may include components including a sense amplifier, a write driver, anda column selection circuit, for example.

The data I/O circuit 40 of FIG. 1 is connected to the read/write circuit30 through the data lines DL. The data I/O circuit 40 is operated by thecontrol logic circuit 50. The data I/O circuit 40 is configured toexchange data DATA with an external system. The data I/O circuit 40 isconfigured to transmit data DATA transmitted from the external system tothe read/write circuit 30 through the data lines DL. The data I/Ocircuit 40 is configured to output data DATA transmitted from theread/write circuit 30 to the external system through the data lines DL.For example, the data I/O circuit 40 may include a component such as adata buffer.

The control logic circuit 50 may be connected to the address decoder 20,the read/write circuit 30, and the data I/O circuit 40. The controllogic circuit 50 is configured to control operations of thesemiconductor device. The control logic circuit 50 may be operated inresponse to a control signal CTRL transmitted from the external system.

FIG. 2 is a block diagram illustrating an example of a memory cell array10 of a semiconductor device illustrated in FIG. 1. Referring to FIG. 2,the memory cell array 10 of the present example may include a pluralityof memory blocks BLK1 to BLKn. Each of the memory blocks BLK1 to BLKnmay have a three-dimensional (3D) structure (or a vertical structure).For example, each of the memory blocks BLK1 to BLKn may include aplurality of cell strings extending in a vertical direction.

FIG. 3 is a perspective view illustrating portions of a memory block ofa semiconductor device according to some embodiments of the inventiveconcepts.

Referring to FIG. 3, a substrate 110 is provided. The substrate 110 mayhave a first conductivity type (e.g., a P-type). A buffer dielectriclayer 122 may be provided on the substrate 110. The buffer dielectriclayer 122 may be a silicon oxide layer. Insulating patterns 125 andhorizontal electrodes may be provided on the buffer dielectric layer122. The horizontal electrodes may be vertically spaced apart from eachother with the insulating patterns 125 therebetween.

The horizontal electrodes may include a lower selection line LSL, firstto eighth word lines WL1 to WL8, and an upper selection line USL. Theinsulating patterns 125 may include silicon oxide. The buffer dielectriclayer 122 may be thinner than the insulating patterns 125. Thehorizontal electrodes may include doped silicon, a metal (e.g.,tungsten), a metal nitride (e.g., titanium nitride), a metal silicide,or any combination thereof. In some embodiments, each of the horizontalelectrodes may include, for example, a barrier layer and a metal layeron the barrier layer. The barrier layer may include a metal nitride(e.g., titanium nitride), and the metal layer may include, for example,tungsten.

The insulating patterns 125 and the horizontal electrodes may constitutea gate structure G. The gate structure G may horizontally extend along afirst direction D1. A plurality of gate structures G may be provided onthe substrate 110. The gate structures G may face each other in a seconddirection D2 that intersects the first direction D1. The upper selectionlines USL may be separated from each other in the second direction D2and may extend in the first direction D1. In FIG. 3, a plurality ofupper selection lines USL and one lower selection line LSL are disposedin a single gate structure G. However, the inventive concepts are notlimited thereto.

An isolation region 121 extending in the first direction D1 may beprovided between the gate structures G that are adjacent to each other.Common source lines CSL are provided in the substrate 110 under theisolation regions 121, respectively. The common source lines CSL may bespaced apart from each other and may extend in the substrate 110 alongthe first direction D1. The common source lines CSL may have a secondconductivity type (e.g., an N-type) different from the firstconductivity type. Unlike the embodiment illustrated in FIG. 3, thecommon source lines CSL may be line-shaped patterns that are providedbetween the substrate 110 and the lower selection lines LSL and extendin the first direction D1.

A plurality of cell pillars PL may penetrate the horizontal electrodesLSL, WL1 to WL8, and USL and may be connected to the substrate 110. Eachof the cell pillars PL may have an axis extending upward from thesubstrate 110 (e.g., extending in a third direction D3). First ends ofthe cell pillars PL may be connected to the substrate 110, and secondends of the cell pillars PL may be connected to interconnectionsextending in the second direction D2. The interconnections may include afirst interconnection BL1 and a second interconnection BL2 that areadjacent to each other and extend in the second direction D2.

A plurality of cell pillars PL coupled to a single upper selection lineUSL may be arranged in a zigzag, a staggered and/or a matrix formation.The plurality of cell pillars PL may include first cell pillars PL1 andsecond cell pillars PL2 that are coupled to the same upper selectionline USL. The first cell pillars PL1 may be nearest to the isolationregion 121, and the second cell pillars PL2 may be farther from theisolation region 121 than the first cell pillars PL1. The second cellpillars PL2 may be shifted from the first cell pillars PL1 in the firstdirection D1 and the second direction D2. Each of the first cell pillarsPL1 and each of the second cell pillars PL2 may be respectivelyconnected to the first interconnection BL1 and the secondinterconnection BL2 through conductive patterns 136 and contacts 138.

A plurality of cell strings may be provided between the interconnections(here, BL1 and BL2) and the common source lines CSL. Theinterconnections BL1 and BL2 may be bit lines of a flash memory device.One cell string may include an upper selection transistor connected toone of the interconnections BL1 and BL2, a lower selection transistorconnected to the common source line CSL, and a plurality of verticalmemory cells between the upper and lower selection transistors. Thelower selection line LSL may correspond to a lower selection gate of thelower selection transistors. The word lines WL1 to WL8 may correspond tocell gates of the plurality of vertical memory cells (when the verticalmemory cells are memory cell transistors, such as NAND flash memory celltransistors). The upper selection line USL may correspond to an upperselection gate of the upper selection transistors. Each cell pillar PLmay include a plurality of vertically stacked memory cells. The lowerselection gate may be a ground selection gate or a ground select line ofthe flash memory device. The upper selection gate may be a stringselection gate or a string select line of the flash memory device.

A data storage element 130 may be provided between each of the cellpillars PL and each of the word lines WL1 to WL8. In FIG. 3, a datastorage element 130 is disposed between corresponding ones of the wordlines WL1 to WL8 and the insulating patterns 125 and the cell pillarsPL. In some embodiments, at least a portion of the data storage element130 may extend to be disposed between each of the cell pillars PL andthe insulating patterns 125. A gate insulating layer (e.g., instead of adata storage element 130) may be provided between each of the upper andlower selection lines USL and LSL and each of the cell pillars PL.Further description of word lines, bit lines, select lines, commonsource lines, etc., in NAND flash memory and their operation andfunction (e.g., for writing, reading or programming) and which may beimplemented in the embodiments described herein may be found in U.S.Pat. Nos. 8,514,625 and 5,473,563, both of which are incorporated byreference in their entirety.

FIG. 4A is a plan view illustrating an embodiment of a memory block ofFIG. 3, and FIG. 4B is a cross-sectional view taken along a line I-I′ ofFIG. 4A. FIG. 4C is an enlarged view of a portion ‘A’ of FIG. 4B. InFIG. 4A, the data storage element is not illustrated for the purpose ofsimplifying the drawing.

Referring to FIGS. 4A, 4B, and 4C, the isolation region 121 may befilled with an isolation insulating layer 120. The isolation insulatinglayer 120 may be a silicon oxide layer.

The cell pillars PL may be semiconductor pillars. Each of the cellpillars PL may have a solid cylinder-shape or a hollow cylinder-shape(e.g., a macaroni-shape or tubular configuration). An inner region ofthe cell pillar PL having the tubular-shape may be filled with a fillinginsulating layer 137. The filling insulating layer 137 may be formed ofa silicon oxide layer. The conductive pattern 136 may be provided on oneend of each of the cell pillars PL. A drain region D may be provided inone end portion of the cell pillar PL that is in contact with theconductive pattern 136.

The data storage element 130 may include a tunnel insulating layer 132adjacent to each of the cell pillars PL, a blocking insulating layer 134adjacent to each of the word lines WL1 to WL8, and a charge storagelayer 133 between the tunnel insulating layer 132 and the blockinginsulating layer 134, as illustrated in FIG. 4C. The tunnel insulatinglayer 132 may include a silicon oxide layer. The blocking insulatinglayer 134 may include a high-k dielectric layer (e.g., an aluminum oxidelayer or a hafnium oxide layer). The blocking insulating layer 134 maybe a multi-layer consisting of a plurality of thin layers. For example,the blocking insulating layer 134 may include a silicon oxide layer, analuminum oxide layer, and/or a hafnium oxide layer. As illustrated inFIG. 15B, the blocking insulating layer 134 may include, for example, asilicon oxide layer 134 a and a high-k dielectric layer 134 b that aresequentially stacked. The charge storage layer 133 may be a charge traplayer, or an insulating layer including conductive nano particles. Thecharge trap layer may include, for example, a silicon nitride layer.

At least a portion of the data storage element 130 may extend to bedisposed between each of the word lines WL1 to WL8 and the insulatingpatterns 125. Another portion of the data storage element 130 may extendto be disposed between each of the cell pillars PL and the insulatingpatterns 125. For example, the blocking insulating layer 134 may bedisposed between each of the word lines WL1 to WL8 and the insulatingpatterns 125 in FIG. 4C. For example, the tunnel insulating layer 132and the charge storage layer 133 may be disposed between each of thecell pillars PL and the insulating patterns 125 in FIG. 4C.

A protection layer 131 may be provided between the charge storage layer133 and each of the insulating patterns 125. The protection layer 131may be a silicon oxide layer.

According to the inventive concepts, a thickness Lg of each of the wordlines WL1 to WL8 may correspond to a length of each of the cell gates.An intergate dielectric layer 150 may be provided between neighboringword lines WL1 to WL8. The intergate dielectric layers 150 and the wordlines WL1 to WL8 may be alternately stacked. Each of the intergatedielectric layers 150 includes one of the insulating patterns 125. Eachof the intergate dielectric layers 150 may also include a pair of theblocking insulating layers 134 in FIG. 4C. A thickness of one of theintergate dielectric layers 150 corresponds to a space Ls betweenneighboring word lines WL. A pitch of the vertical memory cells may be asum of the thickness Lg and the space Ls.

According to some embodiments of the inventive concepts, the thicknessLg of each of the word lines WL1 to WL8 is greater than the space Lsbetween the word lines (i.e., the thickness of the intergate dielectriclayer 150). A ratio of the thickness Lg to the space Ls (Lg/Ls) may bein the range of about 1.0 to about 1.4. In particular, the ratio of thethickness Lg to the space Ls (Lg/Ls) may be in the range of about 1.2 to1.4. For example, the thickness Lg of each of the word lines WL1 to WL8may be equal to or greater than about 35 nm. For example, the smallestthickness of the thicknesses of word lines WL1 to WL8 may be less than42 nm, such as in the range of 35 nm to 42 nm. The thickness (i.e. Ls)of each of the intergate dielectric layers 150 may be equal to orgreater than 27 nm.

A method of manufacturing a semiconductor device according to someembodiments of the inventive concepts will be described hereinafter.FIGS. 5A to 10A, 13A, and 14A are plan views corresponding to FIG. 4A.FIGS. 5B to 10B, 13B, and 14B are cross-sectional views corresponding toFIG. 4B. FIGS. 5C to 10C, 13C, and 14C are enlarged views of portions‘B’ of FIGS. 5B to 10B, 13B, and 14C, respectively. FIG. 15A is anenlarged view of a portion ‘C’ of FIG. 14A. FIG. 15B is an enlarged viewof a portion ‘D’ of FIG. 14C and is a cross-sectional view taken along aline II-IF of FIG. 15A.

Referring to FIGS. 5A to 5C, a substrate 110 is provided. The substrate110 may have a first conductivity type (e.g., a P-type). A bufferdielectric layer 122 may be formed on the substrate 110. The bufferdielectric layer 122 may be, for example, a silicon oxide layer. Thebuffer dielectric layer 122 may be formed by, for example, a thermaloxidation process. Sacrificial layers 123 and insulating layers 124 maybe provided to be alternately stacked on the buffer dielectric layer122. A thickness of an uppermost insulating layer may be greater thanthose of other insulating layers. The insulating layers 124 may be, forexample, silicon oxide layers. The sacrificial layers 123 may include amaterial having a wet etching property different from those of thebuffer dielectric layer 122 and the insulating layers 124. For example,each of the sacrificial layers 123 may include a silicon nitride layer,a silicon oxynitride layer, a poly-silicon layer, or apoly-silicon-germanium layer. The sacrificial layers 123 and theinsulating layers 124 may be formed by, for example, chemical vapordeposition (CVD) method.

Thicknesses of the sacrificial and insulating layers 123 and 124 and aratio of the thicknesses of the layers 123 and 124 may obtain thethickness Lg of the word lines WL1 to WL8 and the space Ls between theword lines WL1 to WL8 as described with reference to FIG. 4C.

Referring to FIGS. 6A to 6C, cell holes H are formed to penetrate theinsulating layers 124, the sacrificial layers 123 and the bufferdielectric layer 122. The cell holes H expose the substrate 110.

Referring to FIGS. 7A to 7C and 8A to 8C, cell pillars PL are formed inthe cell holes H, respectively. The formation process of the cellpillars PL will be described in more detail.

Referring to FIGS. 7A to 7C, a protection layer 131 is formed onsidewalls of the cell holes H. The protection layer 131 may be a siliconoxide layer. A charge storage layer 133 is formed on the protectionlayer 131. The charge storage layer 133 may be a charge trap layer, oran insulating layer including conductive nano-particles. For example,the charge trap layer may include a silicon nitride layer. A tunnelinsulating layer 132 is formed on the charge storage layer 133. Thetunnel insulating layer 132 may be a silicon oxide layer. The protectionlayer 132, the tunnel insulating layer 132, and the charge storage layer133 may be formed by an atomic layer deposition (ALD) method or a CVDmethod.

A first sub-semiconductor layer 135 a may be formed on the tunnelinsulating layer 132. The first sub-semiconductor layer 135 a isanisotropically etched to expose the substrate 110. Thus, the firstsub-insulating layer 135 a may be converted into a spacer on the innersidewall of the tunnel insulating layer 132. A second sub-semiconductorlayer 135 b may be formed on the first sub-semiconductor layer 135 a.The second sub-semiconductor layer 135 b may contact with the substrate110. Each of the first and second sub-semiconductor layers 135 a and 135b may be formed by an ALD method or a CVD method. Each of the first andsecond sub-semiconductor layers 135 a and 135 b may be an amorphoussilicon layer.

Referring to FIGS. 8A to 8C, a thermal treatment process may beperformed to convert the first and second sub-semiconductor layers 135 aand 135 b into a semiconductor layer 135. The semiconductor layer 135may be a poly-crystalline silicon layer or a single-crystalline layer.

The semiconductor layer 135 may be formed to partially fill the cellholes H, forming a tubular structure within the cell holes H. Aninsulating material 137 may be formed within the tubular semiconductorlayer 135 to completely fill the cell holes H. The insulating material137 and the semiconductor layer 135 may be planarized to expose theuppermost insulating layer. Thus, cell pillars PL having a hollowcylindrical shape filled with a filling insulating layer 137 may beformed in the cell holes H, respectively. The cell pillars PL may be asemiconductor layer having the first conductivity type. Unlike theembodiment illustrated in the drawings, the semiconductor layer 135 maybe formed to fill the cell holes H. In this case, the filling insulatinglayer may be omitted.

Top end portions of the cell pillars PL may be recessed to be lower thana top surface of the uppermost one of insulating layers 124. Conductivepatterns 136 may be formed in the cell holes H having the recessed cellpillars PL, respectively. The conductive patterns 136 may include adoped poly-silicon or a metal. Dopant ions of a second conductivity typemay be implanted into the conductive patterns 136 and upper portions ofthe recessed cell pillars PL, thereby forming drain regions D. Forexample, the second conductivity type may be an N-type.

Referring to FIGS. 9A to 9C, the insulating layer 124, the sacrificiallayers 123, and the buffer dielectric layer 122 are successivelypatterned to form isolation regions 121 spaced apart from each other.The isolation regions 121 extend in a first direction D1 and expose thesubstrate 110. The thus patterned insulating layers 124 correspond toinsulating patterns 125. Before or after the isolation regions 121 areformed, the uppermost one of insulating layers 124/125 and an uppermostone of the sacrificial layers 123 may be patterned to form an opening127. The opening 127 may be disposed between the isolation patterns 121.The opening 127 may extend between the isolation patterns 121 in thefirst direction D1, thereby dividing the uppermost sacrificial layerinto two segments. An insulating layer (e.g., a silicon oxide layer) mayfill the opening 127.

Referring to FIGS. 10A to 10C, the sacrificial layers 123 exposed by theisolation regions 121 are selectively removed to form recess regions126. The recess regions 126 correspond to regions where the sacrificiallayers 123 are removed. The recess regions 126 are defined by the cellpillars PL and the insulating patterns 126. If the sacrificial layers123 include silicon nitride layers or silicon oxynitride layers, theremoval process of the sacrificial layers 123 may be performed using anetching solution including phosphoric acid. Portions of the protectionlayer 131 on sidewalls of the cell pillars PL may be exposed by therecess regions 126.

The protection layer 131 may prevent the charge storage layer 133 frombeing damaged by the etching solution that removes the sacrificiallayers 123. The protection layer 131 exposed by the recess regions 126may be selectively removed. If the protection layer 131 is a siliconoxide layer, the protection layer 131 may be removed by, for example, anetching solution including hydrofluoric acid. Thus, the recess regions126 may expose portions of the charge storage layer 133.

It is desired that a total height of a stack of the sacrificial layers123 and the insulating layer 124 is reduced in order to easily form thecell holes H described above. Thus, an aspect ratio of the cell holes Hmay be reduced to better etch the stack of the sacrificial layers 123and the insulating layer 124. Reduction of the thicknesses of thesacrificial layers 123 and/or the insulating layers 124 may reduce thetotal height of the stack without reduction of the number of stackedlayers.

The reduction of the thickness of the sacrificial layers 123 may causereduction of the thickness Lg of each of the word lines WL1 to WL8described with reference to FIG. 4C. Thus, the length of the gatecorresponding to the thickness Lg of each of the word lines WL1 to WL8may be reduced to increase resistance of the word lines WL1 to WL8.Additionally, the reduction of the thickness of the sacrificial layers123 may cause various problems in a process of filling the recessregions 126 with a conductive layer 140. (See FIGS. 13A to 13C and 14Ato 14C)

The reduction of the thickness of the insulating layers 124 may causereduction of the space Ls between the word lines WL1 to WL8 describedwith reference to FIG. 4C. If the space Ls between the word lines WL1 toWL8 is reduced too much, the insulating layer 124 may not endure a WLvoltage applied between the word lines WL1 to WL8. If the insulatinglayer 124 is too thin, a breakdown phenomenon may occur in theinsulating layer 124 by the WL voltage (for example, about 15V). Thus,if the space Ls between the word lines WL1 to WL8 is too narrow,interference and/or a leakage current may occur between the word linesWL1 to WL8 such that errors may occur in read and/or write operations ofthe memory cell. Additionally, the insulating layers 124 may be deformedby a mechanical stress caused due to a capillary effect in the removalprocess of the sacrificial layers 123. (See a reference designator E ofFIG. 11) This phenomenon may cause defects and/or weakness of the memorycells.

Thus, the thickness of the sacrificial layers 123 and/or the thicknessof the insulating layers 124 should be suitably adjusted in the processillustrated in FIGS. 5A to 5C. The total height of the stack of thesacrificial layers 123 and the insulating layers 124 should be reducedbut the thickness of the sacrificial layers 123 and/or the insulatinglayers 124 have a lower limitation. As illustrated in FIG. 12, when thethickness of the insulating layer 124 is equal to or greater than about26 nm, the leakage current is relatively small.

Referring to FIGS. 13A to 13C, a blocking insulating layer 134 may beformed in the recess regions 126. The blocking insulating layer 134 maybe conformally formed on a top surface and a bottom surface of theinsulating patterns 125 and on portions of the charge storage layer 133that are exposed in the recess region 126. The blocking insulating layer134 may include a high-k dielectric layer (e.g., an aluminum oxide layeror a hafnium oxide layer). The blocking insulating layer 134 may beformed of a plurality of thin layers. For example, the blockinginsulating layer 134 may include an aluminum oxide layer and a siliconoxide layer, and a stack order and number of the aluminum oxide layersand a silicon oxide layers may be variously modified. The blockinginsulating layer 134 may be formed by an ALD method and/or a CVD methodthat have an excellent step coverage property.

Referring to FIGS. 13A to 13C, 14A to 14C, 15A and 15B, a conductivelayer 140 is formed on the blocking insulating layer 134. The conductivelayer 140 may include at least one of a doped silicon layer, a metallayer, a metal nitride layer, and a metal silicide layer. The conductivelayer 140 may be formed by a CVD method or an ALD method. In someembodiments, the conductive layer 140 may include a barrier layer 142and a metal layer 144 disposed on the barrier layer 142. The barrierlayer 142 may include a metal nitride layer (e.g., a titanium nitridelayer). For example, the metal layer 144 may include a tungsten layer.In other embodiments, the conductive layer 140 may include apoly-silicon layer and a silicide layer on the poly-silicon layer. Inthis case, forming the conductive layer 140 may include forming apoly-silicon layer, removing a portion of the poly-silicon layeradjacent to the isolation region 121 to recess the poly-silicon layer,forming a metal layer on the recessed poly-silicon layer, thermallytreating the metal layer, and removing an unreacted metal layer. Themetal layer for the formation of the silicide layer may includetungsten, titanium, cobalt, or nickel.

The process of filling the recess region 126 with the conductive layer140 will be described in more detail. The conductive layer 140 isprovided from the isolation region 121 into the recess region 126. Astime passes (FIGS. 13A to 13C→FIGS. 14A to 14C), a space {circle around(a)} between the cell pillars {circle around (1)} nearest to theisolation region 121 may be clogged or filled with the conductive layer140 before a space {circle around (b)} between cell pillars {circlearound (2)} far from the isolation region 121 is completely filled withthe conductive layer 140. Thus, hollow regions S may be generated withinthe conductive layer 140. The hollow regions S may be connected to eachother to extend in one direction (e.g., the first direction D1). Thus, avertical/horizontal thickness of the conductive layer 140 in the recessregion 126 may be progressively reduced as a distance from the isolationregion 121 increases.

In this case, various problems may be caused. First, resistances of wordlines WL1 to WL8 formed of the conductive layer 140 may increase. Inparticular, the resistances of the word lines WL1 to WL8 adjacent to thecell pillars {circle around (2)} far from the isolation region 121 maybe very great. Therefore, a voltage or current applied to the datastorage element may be varied according to a distance between the datastorage element and the isolation region 121. Secondly, the insulatingpatterns 125, the data storage element 130 and/or the cell pillars PLmay be damaged during a subsequent process by chemicals permeating intoand/or confined in the hollow region S.

Referring to FIGS. 15A and 15B, the blocking insulating layer 134 mayinclude a silicon oxide layer 134 a and an aluminum oxide layer 134 b.The chemicals permeating into and/or confined in the hollow region S maypass through the conductive layer 140 and then may partially dissolvethe blocking insulating layer 134. (See a reference designator V.) Forexample, the chemicals may be a fluorine gas. The fluorine gas may begenerated from a source material (e.g., WF6) for the formation of theconductive layer 140. Thus, electrical characteristics between the wordlines WL1 to WL8 and/or between the cell pillars PL and the word linesWL1 to WL8 may be deteriorated. Additionally, a data retentioncharacteristic of the data storage elements 130 may be deteriorated andmay be non-uniform. Reducing the size and the number of the hollowregions S and/or to remove the hollow regions S may address theseissues.

A height of the recess region 126 may be increased in order to achievethe above requirements. Thus, the generation of the hollow region S canbe reduced and the source material can be easily removed from the recessregion 126 to the isolation region 121 during the formation of theconductive layer 140. For example, a thickness of each of thesacrificial layers 123 corresponding to the recess region 126 may beequal to or greater than 35 nm. In particular, the conductive layer 140having a thickness of about 35 nm or more may provide a low resistanceof the word lines WL1 to WL8.

Referring again to FIGS. 4A to 4C, the conductive layer 140 formedoutside the recess regions 126 is removed to form horizontal electrodesin the recess regions 126, respectively. The horizontal electrodes mayinclude a lower selection line LSL, word lines WL1 to WL8 and an upperselection line USL. Two upper selection lines USL laterally separatedfrom each other may be included in one gate structure. The two upperselection lines USL may extend in the first direction D1.

The conductive layer 121 formed in the isolation regions 121 may beremoved to expose the substrate 110. Dopant ions of the secondconductivity type may be heavily implanted into the exposed substrate110 to form common source lines CSL.

An isolation insulating layer 120 may be formed to fill the isolationregions 121. The cell pillars PL arranged in the second direction D2 maybe electrically connected in common to one interconnection BL1 or BL2.(See FIG. 3) Conductivity, electric insulation and/or data retentioncharacteristic of the word lines can be improved by the adjustment ofthe thickness of the word lines WL1 to WL8 and the thickness of theintergate dielectric layer 150 between the word lines WL1 to WL8according to the inventive concepts.

FIGS. 16A to 16D are enlarged views corresponding to FIG. 4C toillustrate other embodiments of a memory block of FIG. 3.

Referring to FIG. 16A, all of the tunnel insulating layer 132, thecharge storage layer 133 and the blocking insulating layer 134constituting the data storage element 130 may be formed in the recessregion 126. In this case, the protection layer 131 may not be formed.The cell pillars PL may be formed in the cell holes H in the processesof FIGS. 7A to 7C and 8A to 8C without the formation of the protectionlayer 131, the charge storage layer 133 and the tunnel insulating layer132. The cell pillars PL may be formed by depositing a semiconductorlayer in the cell holes H. Thereafter, the tunnel insulating layer 132,the charge storage layer 133, and the blocking insulating layer 134 maybe sequentially formed in the recess region 126 in the process of FIGS.13A to 13C. Next, the conductive layer 140 may be formed on the blockinginsulating layer 134.

In the structure described above, an intergate dielectric layer 150includes the tunnel insulating layer 132, the charge storage layer 133,the blocking insulating layer 134, and one of the insulating patterns125. In this example, a thickness Ls of the intergate dielectric layer150 is equal to a sum of the thicknesses of a pair of data storageelements 130 and one of the insulating patterns 125.

Referring to FIG. 16B, the charge storage layer 133 and the blockinginsulating layer 134 may be formed in the recess region 126. In theprocesses of FIGS. 7A to 7C and 8A to 8C, the protection layer 131 andthe tunnel insulating layer 132 may be formed in the cell holes H andthen the cell pillars PL may be formed in the cell holes H. The cellpillars PL may be formed by a similar method to the processes describedwith reference to FIGS. 7A to 7C and 8A to 8C. Thereafter, the chargestorage layer 133 and the blocking insulating layer 134 may besequentially formed in the recess region 126 in the process of FIGS. 13Ato 13C. Subsequently, the conductive layer 140 may be formed on theblocking insulating layer 134.

In this structure, an intergate dielectric layer 150 includes the chargestorage layer 133, the blocking insulating layer 134, and one of theinsulating patterns 125. In this example, a thickness Ls of theintergate dielectric layer 150 is equal to a sum of the thicknesses of apair of the charge storage layers 133, a pair of blocking insulatinglayers 134 and one of the insulating patterns 125.

Referring to FIG. 16C, all of the tunnel insulating layer 132, thecharge storage layer 133 and the blocking insulating layer 134constituting the data storage element 130 may be formed in each of thecell holes H. The protection layer 131, the blocking insulating layer134, the charge storage layer 133, and the tunnel insulating layer 132are sequentially formed in the cell holes H in the processes of FIGS. 7Ato 7C and 8A to 8C. The cell pillars PL may be formed on the tunnelinsulating layer 132. The cell pillars PL may be formed by a similarmethod to the processes described with reference to FIGS. 7A to 7C and8A to 8C. Thereafter, the conductive layer 140 may be formed in therecess region 126, such as by the process described with respect toFIGS. 13A to 13C.

In this structure, an intergate dielectric layer 150 includes one of theinsulating patterns 125. A thickness Ls of the intergate dielectriclayer 150 may be the same as the thickness of one of the insulatingpatterns 125.

Referring to FIG. 16D, the data storage element 130 may be a variableresistance pattern. The variable resistant pattern may include one ormore materials having a variable resistance property so that aresistance of the material(s) may be altered.

In some embodiments, the data storage element 130 may include a material(e.g., a phase change material) of which an electrical resistance can bechanged by heat generated from a current passing through an electrodeadjacent thereto. The phase change material may include at least one ofantimony (Sb), tellurium (Te), and selenium (Se). For example, the phasechange material may include a chalcogenide having tellurium (Te) ofabout 20 at % to about 80 at %, antimony (Sb) of about 5 at % to about50 at %, and germanium (Ge). Additionally, the phase change material mayfurther include impurities including at least one of nitrogen (N),oxygen (O), carbon (C), bismuth (Bi), indium (In), boron (B), tin (Sn),silicon (Si), titanium (Ti), aluminum (A1), nickel (Ni), iron (Fe),dysprosium (Dy), and lanthanum (La). The variable resistance pattern maybe formed of one of GeBiTe, InSb, GeSb, and GaSb.

In other embodiments, the data storage element 130 may include a thinlayer structure of which an electrical resistance can be changed usingspin torque transfer of a current passing through the thin layerstructure. The data storage element 130 may have the thin layerstructure configured to exhibit a magnetoresistance property. The datastorage element 130 may include at least one ferromagnetic materialand/or at least one anti-ferromagnetic material.

In still other embodiments, the data storage element 130 may include atleast one of perovskite compounds or transition metal oxides. Forexample, the data storage element 130 may include at least one ofniobium oxide, titanium oxide, nickel oxide, zirconium oxide, vanadiumoxide, (Pr,Ca)MnO₃ (PCMO), strontium-titanium oxide,barium-strontium-titanium oxide, strontium-zirconium oxide,barium-zirconium oxide, or barium-strontium-zirconium oxide.

In the event that the data storage element 130 is the variableresistance pattern, the cell pillars PL may be conductive pillars. Thecell pillars PL may be formed of a conductive material. For example, theconductive material may include at least one of a doped semiconductor, ametal, a conductive metal nitride, a silicide, or a nano-structure(e.g., carbon nanotube or graphene).

In order to realize the structure of FIG. 16D, the protection layer 131and the data storage element 130 are sequentially formed in the cellholes H in the processes of FIGS. 7A to 7C and 8A to 8C. The cellpillars PL may be formed on the data storage element 130. The cellpillars PL may be formed using a deposition process of a conductivematerial. Thereafter, the conductive layer 140 may be formed in therecess region 126 in the process of FIGS. 13A to 13C.

In this structure, the intergate dielectric layer 150 includes one ofthe insulating patterns 125. The thickness Ls of the integratedielectric layer 150 in this example corresponds to the thickness of oneof the insulating patterns 125.

FIG. 17 is a cross-sectional view illustrating an example embodiment ofa memory block of FIG. 3. Referring to FIG. 17, the word lines WL1 toWL8 may include a first group G1 near to the substrate 110, a thirdgroup G3 far from the substrate 110, and a second group G2 between thefirst group G1 and the third group G3. The first group G1, the secondgroup G2, and the third group G3 may correspond to one or more lowerword lines, one or more middle word lines, and one or more upper wordlines, respectively. The memory cells of each of the vertical stringsmay include one or more lower memory cells, one or more middle memorycells, and one or more upper memory cells. A ratio of the thickness ofeach word line to the space between the word lines (i.e., the thicknessof the intergate dielectric layer 150) in at least one group may bedifferent from those in other groups. For example, the ratio (Lg/Ls) ofthe thickness of each word line to the space between the word lines ofone group (e.g., second group G2) may be at least 10% larger than, atleast 20% larger than or at least 40% larger than the ratio (Lg/Ls) ofthe thickness of each word line to the space between the word lines ofanother group or other groups (e.g., the first group G1 and/or thirdgroup G3). A larger Lg/Ls ratio may be helpful at locations of cellpillars having a larger diameter. This larger ratio Lg/Ls may be 1.3 orlarger in some examples. In the example above, the portion of the cellpillar at the one group (e.g., group G2) may have a larger diameter thanportions of the cell pillar at the other group(s) (e.g., the first groupG1 and/or third group G3). In other examples, the ratio (Lg/Ls) of thethickness of each word line to the space between the word lines of onegroup (e.g., second group G2) may be at least 10% smaller than, at least20% smaller than or at least 40% smaller than the ratio (Lg/Ls) of thethickness of each word line to the space between the word lines ofanother group or other groups (e.g., the first group G1 and/or thirdgroup G3). A smaller Lg/Ls ratio may be helpful at locations of cellpillars having a more striation. This smaller Lg/Ls ratio may be 1.3 orlower, in some examples. In this latter example, the portion of the cellpillar at the one group (e.g., group G2) may have a smaller diameterthan portions of the cell pillar at the other group(s) (e.g., the firstgroup G1 and/or third group G3). The different Lg/Ls ratios describedherein may be obtained by providing different thicknesses of one or bothof Lg and Ls, such as differing word line thicknesses Lg of appropriategroups (as described with respect to the embodiments herein) by morethan 10%, more than 20% or more than 40%, or by differing spacing Lsbetween word lines of appropriate groups (as described with respect tothe embodiments herein) by more than 10%, or more than 20% or more than40%.

FIGS. 18A to 18C are plan views taken along lines A1-A1′, A2-A2′, andA3-A3′ of FIG. 17, respectively, according to one exemplary embodiment.For the purpose of convenience and simplicity in the drawings, only cellpillars PL are illustrated in FIGS. 18A to 18C. The plan views takenalong the lines A1-A1 A2-A2′, and A3-A3′ correspond to the first groupG1, the second group G2, and the third group G3, respectively. Each ofthe cell pillars PL may be classified into a lower portion PLa, a middleportion PLb, and an upper portion PLc according to a height of the cellpillar PL, corresponding to the groups.

Referring to FIGS. 18A to 18C, striation may be generated oncircumferences of the cell pillars in a specific group. Cell pillars mayhave non-uniform diameters at corresponding striated locations. Thestriation may be caused by non-uniformity in a reaction of an etchinggas and the sacrificial layers/insulating layers and in a reaction ofthe etching gas and a reaction byproduct. The striation may be generatedmore at positions of the cell holes H corresponding to, for example, thesecond group G2. Thus, the striation of the middle portion PLb may begreater than those of the lower portion PLa and the upper portion PLc.Cell pillars at their striated locations may have a larger surface area(or larger distance around their circumference) than that of cellpillars at their non striated locations (or with less striation). Forexample, striation differences of any of the embodiments describedherein may result in a circumferential lengths of the correspondingportions of the cell pillars differing by more than 5% or more than 10%.

FIGS. 19A to 19C are plan views taken along lines A1-A1′, A2-A2′, andA3-A3′ of FIG. 17, respectively, according to another exemplaryembodiment. For the purpose of convenience and simplicity in thedrawings, only cell pillars PL are illustrated in FIGS. 19A to 19C.Referring to FIGS. 19A to 19C, sizes of the cell holes H at a height ofa specific group may be different from those of other groups. Forexample, a bowing phenomenon may occur in the cell holes H at the heightof the second group G2. Thus, a diameter of the middle portion PLb maybe greater than those of the lower portion PLa and the upper portionPLc. For example, diameters of portions of the cell pillar may differ bymore than 10% or by more than 20%. For example, the diameters of themiddle portion PLb may be greater than 10% or greater than 20% than thediameters of the lower portion PLa and/or the upper portion PLc.

The striation and the bowing may cause non-uniformity of the cellpillars PL according to the groups, so that a dispersion of cellcharacteristics may be increased.

The ratio (Lg/Ls) of the thickness Lg of the word line to the space Lsbetween the word lines (i.e., the thickness Ls of the intergatedielectric layer 150) of at least one group may be different from thoseof other groups. Differing the ratio Lg/Ls may address a non-uniformityof cell characteristics that may otherwise occur or occur to a largerextent. For example, striation and/or the bowing occur in the secondgroup G2 may be addressed by providing a ratio (Lg2/Ls2) of the secondgroup G2 to be different from ratios (Lg1/Ls2 and Lg3/Ls3) of the firstand third groups G1 and G3.

In some embodiments, if the bowing occurs, diameters of the cell holes Hmay be relatively increased such that a distance between the cellpillars PL may be reduced. This phenomenon may cause make thereplacement process of the conductive layer described with reference toFIGS. 13A to 13C and 14A and 14C more difficult. For example, occurrenceof the aforementioned hollow region S and damage of the blockinginsulating layer may result. These problems can be improved byincreasing a thickness of the recess region 126 (i.e., the thickness ofthe sacrificial layer) corresponding to the thickness of the word linesWL1 to WL8 of the group in which the bowing phenomenon occurs. In otherwords, the occurrence of the hollow region S can be inhibited or reducedto reduce the damage of the blocking insulating layer. Thus, the ratio(Lg/Ls) of the group in which the bowing phenomenon occurs may beincreased.

In other embodiments, if the striation is generated, electricalinterference between cells disposed at different heights may beincreased. This problem can be addressed by increasing the space Lsbetween the word lines (i.e., the thickness Ls of the intergatedielectric layer 150) in the group in which the striation is generated.Thus, the ratio (Lg/Ls) of the group in which the striation is generatedmay be reduced.

In still other embodiments, a program speed of a specific group may bedifferent from those of other groups. Likewise, threshold voltages Vthof cells of a specific group may be different from those of othergroups. In these cases, the ratio (Lg/Ls) described above may beadjusted. For example, if the program speed of a specific group isfaster than those of other groups, the space Ls between the word lines(i.e., the thickness Ls of the intergate dielectric layer 150) in thespecific group may be made relatively smaller. Thus, the interferencebetween the word lines in the specific group may be increased to reducethe program speed of the specific group. As a result, the program speedsof all groups can be substantially uniform. In this case, the ratio(Lg/Ls) of the specific group may be less than those of other groups.

As described above, the thicknesses Lg of the word lines WL1 to WL8and/or the spaces Ls between the word lines WL1 to WL8 may benonmonotonically varied along the cell pillar PL as a height from thesubstrate 110 increases. For example, the thickness Lg of the word linemay be relatively larger at locations where the diameters of the cellpillars PL are relatively large. For example, the space Ls between theword lines may be relatively larger at the locations where thenon-uniformity of the diameters of the cell pillars PL is relativelylarge.

FIG. 20 is a schematic block diagram illustrating an example of anelectronic system including a semiconductor device according toembodiments of the inventive concepts.

Referring to FIG. 20, an electronic system 1100 according to embodimentsof the inventive concept may include a controller 1110, an input/output(I/O) unit 1120, a memory device 1130, an interface unit 1140 and a databus 1150. At least two of the controller 1110, the I/O unit 1120, thememory device 1130 and the interface unit 1140 may be coupled to eachother through the data bus 1150. The data bus 1150 may correspond to apath through which data are transmitted. The memory device 1130 mayinclude at least one of the semiconductor devices according toembodiments of the inventive concepts.

The controller 1110 may include at least one of a microprocessor, adigital signal processor, a microcontroller, or other logic deviceshaving a similar function to any one thereof. The I/O unit 1120 mayinclude a keypad, a keyboard and/or a display unit. The memory device1130 may store data and/or commands. The interface unit 1140 maytransmit electrical data to a communication network or may receiveelectrical data from a communication network. The interface unit 1140may operate by wireless or cable. For example, the interface unit 1140may include an antenna for wireless communication or a transceiver forcable communication. Although not shown in the drawings, the electronicsystem 1100 may further include a fast dynamic random access memory(DRAM) device and/or a fast static random access memory (SRAM) devicethat acts as a cache memory for improving an operation of the controller1110.

The electronic system 1100 may be applied to a personal digitalassistant (PDA), a portable computer, a web tablet, a wireless phone, amobile phone, a digital music player, a memory card or other electronicproducts. The other electronic products may receive or transmitinformation data by wireless.

FIG. 21 is a schematic block diagram illustrating an example of a memorysystem including a semiconductor device according to embodiments of theinventive concepts.

Referring to FIG. 21, a memory system 1200 includes a memory device1210. The memory device 1210 may include at least one of thesemiconductor devices according to the aforementioned embodiments.Additionally, the memory device 1210 may further include other types ofsemiconductor memory devices (e.g., a DRAM device and/or a SRAM device).The memory system 1200 may include a memory controller 1220 thatcontrols data communication between a host and the memory device 1210.The memory device 1210 may include at least one of semiconductor devicesaccording to embodiments of the inventive concepts.

The memory controller 1220 may include a central processing unit (CPU)1222 that controls overall operations of the memory card 1200. Inaddition, the memory controller 1220 may include an SRAM device 1221used as an operation memory of the CPU 1222. Moreover, the memorycontroller 1220 may further include a host interface unit 1223 and amemory interface unit 1225. The host interface unit 1223 may beconfigured to include a data communication protocol between the memorysystem 1200 and the host. The memory interface unit 1225 may connect thememory controller 1220 to the memory device 1210. Furthermore, thememory controller 1220 may further include an error check and correction(ECC) block 1224. The ECC block 1224 may detect and correct errors ofdata that are read out from the memory device 1210. Even though notshown in the drawings, the memory system 1200 may further include a readonly memory (ROM) device that stores code data to interface with thehost. The memory system 1200 may be used as a portable data storagecard. Alternatively, the memory system 1200 may realized as solid statedisks (SSD) that are used as hard disks of computer systems.

FIG. 22 is a schematic block diagram illustrating an example of aninformation processing system including a semiconductor device accordingto embodiments of the inventive concepts.

Referring to FIG. 22, a flash memory system 1310 according toembodiments of the inventive concepts may be installed in an informationprocessing system such as a mobile device or a desk top computer. Theinformation processing system 1300 according to embodiments of theinventive concepts may include a modem 1320, a central processing unit(CPU) 1330, a random access memory (RAM) 1340, and a user interface unit1350 that are electrically connected to the memory system 1310 through asystem bus 760. The flash memory system 1310 may be substantially thesame as the aforementioned memory system. The flash memory system 1310may store data processed by the CPU 1330 or data inputted from theoutside of the information processing system 1300. Here, the flashmemory system 1310 may be realized as a solid state disk (SSD). In thiscase, the information processing system 1300 may be able to reliablystore massive data in the memory system 1310. This increase inreliability enables the memory system 1310 to conserve resources forerror correction such that a high speed data exchange function may beprovided to the information processing system 1300. Although not shownin the drawings, the information processing system 1300 may furtherinclude an application chipset, a camera image processor (CIS), and/oran input/output device.

Additionally, the semiconductor devices and the memory systems accordingto embodiments of the inventive concepts may be encapsulated usingvarious packaging techniques. For example, the flash memory devices andthe memory systems according to the aforementioned embodiments may beencapsulated using any one of a package on package (POP) technique, aball grid arrays (BGAs) technique, a chip scale packages (CSPs)technique, a plastic leaded chip carrier (PLCC) technique, a plasticdual in-line package (PDIP) technique, a die in waffle pack technique, adie in wafer form technique, a chip on board (COB) technique, a ceramicdual in-line package (CERDIP) technique, a plastic metric quad flatpackage (PMQFP) technique, a plastic quad flat package (PQFP) technique,a small outline package (SOIC) technique, a shrink small outline package(SSOP) technique, a thin small outline package (TSOP) technique, a thinquad flat package (TQFP) technique, a system in package (SIP) technique,a multi-chip package (MCP) technique, a wafer-level fabricated package(WFP) technique and a wafer-level processed stack package (WSP)technique.

According to embodiments of the inventive concepts, the thicknesses ofthe word lines and/or the spaces between the word lines may be suitablyvaried to improve the uniformity and reliability of the vertical memorycells.

While the inventive concepts have been described with reference toexample embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirits and scopes of the inventive concepts. Therefore, itshould be understood that the above embodiments are not limiting, butillustrative. Thus, the scopes of the inventive concepts are to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing description.

What is claimed is:
 1. A semiconductor device comprising: horizontalelectrodes stacked vertically on a substrate, the horizontal electrodescomprising a first horizontal electrode and a second horizontalelectrode adjacent to each other; an insulating pattern between thefirst horizontal electrode and the second horizontal electrode; a cellpillar penetrating the horizontal electrodes and the insulating patternand connected to the substrate; a first blocking insulating layerbetween the insulating pattern and the first horizontal electrode; afirst charge storage layer between the blocking insulating layer and thefirst horizontal electrode; a second blocking insulating layer betweenthe insulating pattern and the second horizontal electrode; and a secondcharge storage layer between the blocking insulating layer and thesecond horizontal electrode, wherein a distance between the firsthorizontal electrode and the second horizontal electrode is at least 1.3times a thickness of the first horizontal electrode.
 2. Thesemiconductor device of claim 1, wherein the distance between the firsthorizontal electrode and the second horizontal electrode is equal to asum of a thicknesses of the first blocking insulating layer, the secondblocking insulating layer, the first charge storage layer, and thesecond charge storage layer.
 3. The semiconductor device of claim 1,wherein the first charge storage layer extends between the firsthorizontal electrode and the cell pillar.
 4. The semiconductor device ofclaim 1, further comprising a tunnel insulating layer between the firstcharge storage layer and the cell pillar.
 5. The semiconductor device ofclaim 1, wherein the first blocking insulating layer is disposed on anupper surface, a lower surface, and a side surface of the firsthorizontal electrode.
 6. The semiconductor device of claim 1, whereinthe first charge storage layer is disposed on an upper surface, a lowersurface, and a side surface of the first horizontal electrode.
 7. Thesemiconductor device of claim 1, wherein the first charge storage layercomprises silicon nitride.
 8. The semiconductor device of claim 1,wherein the first blocking insulating layer comprises silicon oxide. 9.A semiconductor device comprising: Horizontal electrodes stackedvertically on a substrate, the horizontal electrodes comprising a firsthorizontal electrode and a second horizontal electrode adjacent to eachother; an insulating pattern between the first horizontal electrode andthe second horizontal electrode; a cell pillar penetrating thehorizontal electrodes and the insulating pattern and connected to thesubstrate; a first blocking insulating layer between the insulatingpattern and the first horizontal electrode; a first charge storage layerbetween the blocking insulating layer and the first horizontalelectrode; a second blocking insulating layer between the insulatingpattern and the second horizontal electrode; and a second charge storagelayer between the blocking insulating layer and the second horizontalelectrode, wherein a distance between the first horizontal electrode andthe second horizontal electrode is equal to a sum of a thicknesses ofthe first blocking insulating film, the second blocking insulating film,the first charge storage film, and the second charge storage film. 10.The semiconductor device of claim 9, wherein a distance between thefirst horizontal electrode and the second horizontal electrode isgreater than 1.3 times a thickness of the first horizontal electrode.11. The semiconductor device of claim 9, wherein the first chargestorage layer extends between the first horizontal electrode and thecell pillar.
 12. The semiconductor device of claim 9, further comprisinga tunnel insulating layer between the first charge storage layer and thecell pillar.
 13. The semiconductor device of claim 9, wherein the firstblocking insulating layer is disposed on an upper surface, a lowersurface, and a side surface of the first horizontal electrode.
 14. Thesemiconductor device of claim 9, wherein the first charge storage layeris disposed on an upper surface, a lower surface, and a side surface ofthe first horizontal electrode.
 15. A semiconductor device comprising:Horizontal electrodes stacked vertically on a substrate, the horizontalelectrodes comprising a first horizontal electrode and a secondhorizontal electrode adjacent to each other; an insulating patternbetween the first horizontal electrode and the second horizontalelectrode; a cell pillar penetrating the horizontal electrodes and theinsulating pattern and connected to the substrate; a first blockinginsulating layer between the insulating pattern and the first horizontalelectrode; a first charge storage layer between the blocking insulatinglayer and the first horizontal electrode; a second blocking insulatinglayer between the insulating pattern and the second horizontalelectrode; and a second charge storage layer between the blockinginsulating layer and the second horizontal electrode, wherein the firstcharge storage layer includes silicon nitride, and the first blockinginsulating layer includes silicon oxide
 16. The semiconductor device ofclaim 15, wherein the distance between the first horizontal electrodeand the second horizontal electrode is equal to a sum of a thicknessesof the first blocking insulating layer, the second blocking insulatinglayer, the first charge storage layer, and the second charge storagelayer.
 17. The semiconductor device of claim 15, wherein the firstcharge storage layer extends between the first horizontal electrode andthe cell pillar.
 18. The semiconductor device of claim 15, furthercomprising a tunnel insulating layer between the first charge storagelayer and the cell pillar.
 19. The semiconductor device of claim 15,wherein the first blocking insulating layer is disposed on an uppersurface, a lower surface, and a side surface of the first horizontalelectrode.
 20. The semiconductor device of claim 15, wherein the firstcharge storage layer is disposed on an upper surface, a lower surface,and a side surface of the first horizontal electrode.